The individual at work places the circuit design layout printed on a ‘positive’ translucent film on the laminated and photo-sensitive PCB panel and exposes it to UV light, thereby curing the photo- resist under the clear portions of the film in order to get the circuit printed onto the panel.
The individual at work operates the spraying machine, curing furnace as well as stamping machine or inkjet printer.
The individual on the job is responsible for forming, bending and cutting the components’ extra leads, by using hand tools or machines to make them suitable for the through-hole assembly.
The individual at work is responsible for receiving, understanding and responding to customer queries through telephone or e-mail. The individual records the complaints for follow up, coordinates with other departments to resolve problems and closes non-technical issues raised by customers on the call itself.
The individual at work demonstrates the functioning of the final product manufactured to the customer and gets an approval for dispatch.
The individual at work operates the cutting machine, crimping machine and manually cuts wire and completes connector assembly. The individual is also responsible for checking quality of connector assembly.
The individual at work installs the set-top box at customer’s premises; addresses the field serviceable complaints and coordinates with the technical team for activation of new connections.
The individual at work designs SOC-module function using software and design tools and as per specifications. The individual is also responsible coordinating with other design teams involved in the SOC design.
The individual at work converts the electrical design drawing to wiring and assembly instructions that are easily understood by assembly technicians.
The individual at work reads the IC design, develops the test logic for the chip to detect faults in the circuit and to improve testing features in the chip after fabrication process.
The individual at work operates the automated pick-and-place machine to attach the silicon die or chip on a lead frame or PCB to either glue or solder them. The silicon die, lead frame and solder are used for active components. The chip, conductive adhesive and PCB are used for LEDs.