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Fundamentals of Photolithography and Mask Making

NQR Code:NG-4.5-EH-03729-2025-V1-NIELIT

  • Old Code: NG-4.5-EH-03729-2025-V1-NIELIT

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About this Qualification

Job Description

The Standalone NOS "Fundamentals of Photolithography and Mask Making" is designed to provide foundational knowledge and practical skills required for photolithography processes and mask-making in semiconductor manufacturing. Participants will learn the principles of light exposure, photoresist application, and pattern transfer onto substrates. They will develop hands-on expertise in mask design, alignment, etching, and defect inspection. It equips learners to work in cleanroom environments, ensuring compliance with industry standards and safety protocols. It prepares individuals for roles in photolithography operations within the electronics and semiconductor industries, supporting advanced manufacturing processes.

Eligibility Criteria

Criteria 1 Criteria 2 Experience Training Qualification
3 year Diploma after 10th In relevant field No Experience None
3rd Year of 3 Year Diploma after 10th In relevant field No Experience None
UG 1st year In relevant field No Experience None
12th Passed 1.5 Years None
10th Passed 1.5 Years 2 year NTC

Progression Pathway

  • MEMS Backend Fabrication Engineer -> Semiconductor Fabrication Engineer

Learning Module In Job Role/Qualifcation

National Occupation Standards (NOS)/Module NOS Code Mandatory/ Optional Estimated size (Hours) Nos Credit Level
Fundamentals of Photolithography and Mask Making NIE/ELE/N3302 Mandatory 120 4 4.5