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Essentials of Semiconductors Assembly Test Marking and Packaging

NQR Code:NG-4.5-EH-03735-2025-V1-NIELIT

  • Old Code: NG-4.5-EH-03735-2025-V1-NIELIT

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About this Qualification

Job Description

This Standalone NOS provides an in-depth understanding of the fundamental concepts and practices involved in semiconductor assembly, test, marking, and packaging (ATMP), with a special emphasis on defect analysis and quality control. The course also addresses the entire process flow from fabricated wafer to final packaging, with a focus on the tools, techniques, and quality control measures critical to producing reliable semiconductor devices.

Eligibility Criteria

Criteria 1 Criteria 2 Experience Training Qualification
10th Passed 1.5 Years 2 year NTC
3 year Diploma after 10th In relevant field No Experience None
12th Passed 1.5 Years None
UG 1st year In relevant field No Experience None
3rd Year of 3 Year Diploma after 10th In relevant field No Experience None

Progression Pathway

  • MEMS Backend Fabrication Engineer -> Semiconductor Fabrication Engineer

Learning Module In Job Role/Qualifcation

National Occupation Standards (NOS)/Module NOS Code Mandatory/ Optional Estimated size (Hours) Nos Credit Level
Essentials of Semiconductors Assembly Test Marking and Packaging NIE/ELE/N0137 Mandatory 180 6 4.5