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Fundamentals of Etching Techniques

NQR Code:NG-4.5-EH-03730-2025-V1-NIELIT

  • Old Code: NG-4.5-EH-03730-2025-V1-NIELIT

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About this Qualification

Job Description

This Standalone NOS provides foundational knowledge and practical skills in semiconductor manufacturing. It covers key processes like oxidation, etching (isotropic, anisotropic, and plasma-based), and advanced techniques such as ion-enhanced and high-density plasma etching. Participants will gain hands-on experience in process characterization, optimization, and integration, culminating in a final project. This course is ideal for those seeking expertise in microfabrication processes.

Eligibility Criteria

Criteria 1 Criteria 2 Experience Training Qualification
3 year Diploma after 10th In relevant field No Experience None
3rd Year of 3 Year Diploma after 10th In relevant field No Experience None
10th Passed 1.5 Years 2 year NTC
UG 1st year In relevant field No Experience None
12th Passed 1.5 Years None

Progression Pathway

  • MEMS Backend Fabrication Engineer -> Semiconductor Fabrication Engineer

Learning Module In Job Role/Qualifcation

National Occupation Standards (NOS)/Module NOS Code Mandatory/ Optional Estimated size (Hours) Nos Credit Level
Fundamental of Etching Techniques NIE/ELE/N3304 Mandatory 30 1 4.5